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Home Manufacturing

Manufacturing: PM lays foundation stones for semiconductor fabrication facilities

Fiinews by Fiinews
March 15, 2024
in Manufacturing
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PM lays foundation stones for three semiconductor facilities.

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40,000+ compliances have been abolished and rules for FDI have been simplified

The Prime Minister, Narendra Modi, has laid foundation stones three semiconductor projects worth about Rs.1.25 lakh crores via video conferencing on 13 Mar while addressing the ‘India’s Techade: Chips for Viksit Bharat’ program.

The facilities inaugurated today are – Semiconductor fabrication facility at the Dholera Special Investment Region (DSIR), Gujarat, Outsourced Semiconductor Assembly and Test (OSAT) facility at Morigaon, Assam, and the Outsourced Semiconductor Assembly and Test (OSAT) facility at Sanand, Gujarat https://www.ibef.org/industry/manufacturing-sector-india .

The three projects https://ism.gov.in/ will play a key role in making India a semiconductor hub, said PM Modi, noting the centrality of electronic chips in the technology-driven 21st century, and underlining that ‘Made in India’ and ‘Designed in India’ chips will play a major role in taking India towards self-reliance and modernization.

In the last few years, the Prime Minister informed that more than 40,000 compliances have been abolished and rules for FDI have also been simplified, as defence, insurance and telecom sectors have been liberalized for investors.

PM Modi https://www.pmindia.gov.in/en/ also highlighted the huge presence of Indian talent in global chip design and manufacturing, adding that the talent ecosystem of India is completed as the nation moves forward today in the semiconductor manufacturing sector.

Projects:

The Rs.91,000 crore Semiconductor fabrication facility at the Dholera Special Investment Region (DSIR) will be set up by Tata Electronics Private Limited (TEPL) under the Modified Scheme for setting up of Semiconductor Fabs in India https://www.sidm.in/ .

The Rs.27,000 crore Outsourced Semiconductor Assembly and Test (OSAT) facility in Morigaon, Assam, will be set up by Tata Electronics Private Limited (TEPL) https://www.tata.com/ under the Modified Scheme for Semiconductor Assembly, Testing, Marking and Packaging (ATMP).

The Rs.7,500 crore Outsourced Semiconductor Assembly and Test (OSAT) facility in Sanand, will be set up by CG Power and Industrial Solutions Limited under the Modified Scheme for Semiconductor Assembly, Testing, Marking and Packaging (ATMP). Fiinews.com

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